Q1: What is CoPoS?
CoPoS (Chip-on-Panel-on-Substrate) is a next-generation advanced panel-level packaging technology. It utilizes rectangular panels to replace part of the wafer fabrication process, improving area utilization and reducing packaging costs.

Q2: Why does CoPoS require megasonic cleaning?
Processes such as RDL, electroplating, etching, exposure, and bonding can easily leave behind particles and chemical contaminants. Megasonic cleaning can reduce particle defects and improve packaging yield.

Q3: What is TGV (Through Glass Via)?
TGV is a glass substrate through-hole technology widely used in Glass Core, AI packaging, high-frequency and high-speed components, and advanced packaging.

Q4: Which sites in the TGV process are suitable for implementing ultrasonic or megasonic cleaning?
It can be applied after laser drilling, after etching, during hole cleaning, before metallization, before and after electroplating, after CMP/grinding, and before packaging cleaning to help remove residues, glass powder, and particles from the holes.

Q5: How does ultrasonic cleaning improve TGV etching efficiency?
Ultrasonic cleaning promotes reagent exchange within the vias, reduces bubble retention, accelerates the etching reaction, and improves via cleaning effectiveness and process uniformity.

Q6: What is FOPLP?
FOPLP (Fan-Out Panel Level Packaging) uses rectangular panels for fan-out packaging, reducing costs and supporting large-size packages.

Q7: Which FOPLP processes are suitable for ultrasonic cleaning?
EMC post-grinding cleaning, ABF laser-cut residual adhesive cleaning, RDL pre- and post-processing cleaning, post-plating cleaning, pre-dicing cleaning, and pre-packaging cleaning.

Q8: Why is Megasonic cleaning needed after EMC grinding?
It effectively removes grinding powder and fine particles, reducing subsequent RDL defects and poor adhesion.

Q9: Can megasonic cleaning be used after ABF laser-cutting?
Yes, it helps remove laser carbides, residual adhesive, and particles, improving the quality of subsequent electroplating and metal filling.

Q10: What is the difference between megasonic and conventional ultrasound?
Megasonic (approximately 0.8~2MHz) uses micro-flow cleaning, suitable for precision semiconductor materials; conventional ultrasound (40~160kHz) has stronger cavitation erosion and is suitable for general industrial parts.

Q11: What cleaning solutions does Zhaoyang offer?
We offer Bath Type cleaning, Megasonic Shower, Ultrasonic Shower, Spot Nozzle, customized cleaning modules, and process verification services.

Q12: What materials can be cleaned?
Glass substrates, wafers, RDLs, carriers, EMC, ABF, ceramics, quartz, optical components, and precision metal parts.

Q13: Can the equipment be customized?
Customization is available based on requirements such as size, frequency, power, chemical solutions, automated handling, SECS/GEM, MES, etc.

Q14: Does Zhaoyang provide sample testing?
Yes, we provide sample testing, process evaluation, and optimal cleaning parameter recommendations for our ultrasonic/megason experimental center.