Author: Lin Yu-Jou | Published: January 17, 2025, 3:55 PM | Categories: Semiconductor, Materials & Equipment, Panels
2025 Electronics Manufacturing Equipment Expo to Launch in April with New PLP Zone Highlighting Panel-Level Packaging Trends
The 2025 Electronics Manufacturing Equipment Expo will take place this April, debuting a brand-new "PLP Panel-Level Packaging Zone" focused on the latest trends in panel-level packaging (PLP).
According to the Taiwan Electronic Manufacturing Equipment Industry Association, the event will showcase the world's most advanced packaging technologies, products, and solutions. It will feature the latest developments in panel-level packaging technologies, equipment, and materials, while also promoting localized international supply chains and the globalization of electronic equipment. Exhibits will include etching/laser/electroplating equipment, equipment system integration, redistribution layer (RDL) technology, dicing machines, RDL equipment, wet process equipment, temporary bonding machines, dispensing equipment, die pick-and-place equipment, through-glass vias (TGV), glass substrates, PLP handling boxes, and transport systems.
The event will also host a series of advanced technology forums covering four major themes: heterogeneous integration, PLP panel-level packaging, compound semiconductors, and silicon photonics. Among these, the PLP Panel-Level Packaging Forum is a highlight, featuring the theme "Transforming Round to Square, Creating New Opportunities."
The forums are expected to feature over 40 industry experts from around the globe, addressing challenges such as large-area chip bonding and debonding yield, warpage issues, substrate processing, and metal line adhesion techniques while sharing the latest solutions.
The expo has already attracted a wide range of industry-leading suppliers, including SÜNNTEK, Gudeng, DA Silver, U-Tech, DIJET, Marketech, Gudeng Precision, C Sun, Chroma, Aurotek, CoreTech, Zinnor, Gigaphoton, ITRI, and more. These participants will present cutting-edge materials, equipment, and technical solutions, positioning the event as a pivotal opportunity for Taiwan to establish a robust supply chain for panel-level packaging.
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