The Global ALD Equipment Market size is expected to reach $6.5 billion by 2028, rising at a market growth of 8.3% CAGR during the forecast period.

For the development of next-generation devices, they are also utilized to coat high aspect ratio nanostructures, like nanowires and nanotubes.

Atomic layer deposition is a vapor-phase deposition process, which was also historically known as atomic layer epitaxy, which is used to create ultra-thin films with perfect growth control. ALD is currently undergoing significant evolution, mostly due to the ongoing trend of electronic device downsizing. High-quality thin films are also rapidly helping many other cutting-edge technologies.

The precursor molecule interacts with the surface in a self-limiting manner in each alternate pulse, ensuring that the reaction terminates after all of the reactive groups on the substrate have been utilized. The type of precursor-surface contact determines whether an ALD cycle is complete.

Depending on the need, the ALD cycle can be repeated more than once to increase the number of thin film layers. As ALD is frequently carried out at low temperatures, which is advantageous when working with delicate substrates, certain thermally unstable precursors can still be used as long as the decomposition rate is moderate.

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